Influence of Li Addition to Zn-Al Alloys on Cu Substrate During Spreading Test and After Aging Treatment

Tomasz Gancarz, Janusz Pstruś, Grzegorz Cempura, Katarzyna Berent
Journal of Electronic Materials, Volume 45, Issue 12, pp 6067–6078, 2016
tekst: https://link.springer.com/article/10.1007/s11664-016-4815-8